US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 4 for "Bonding structures in semiconductor packaged device and method of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,150, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bonding structures in semiconductor packaged device and method of forming same" was invented by Hao Chun Liu (Hsinchu, Taiwan), Ching-Wen Hsiao (Hsinchu, Taiwan), Kuo-Ching Hsu (Chung-Ho, Taiwan) and Mirng-Ji Lii (Sinpu Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and a method of forming the same are provided. The semiconductor device includes a die structure including a plurality of die regions and a plurality of first seal rings. Each of the plurality of first seal rings surrounds a corresponding die regio...