US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 4 for "Apparatus for fabricating a semiconductor structure and method of fabricating a semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,019, issued on Nov. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Apparatus for fabricating a semiconductor structure and method of fabricating a semiconductor structure" was invented by Keith Kuang-Kuo Koai (Hsinchu County, Taiwan), Shih-Kuo Liu (Nantou County, Taiwan), Wen-Chih Wang (New Taipei, Taiwan) and Hsin-Liang Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method for fabricating a semiconductor structure, including placing a wafer on a chuck, wherein the wafer is surrounded by a focus ring, the focus ring is supported by a first actuator, wherei...