US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "Trim free wafer bonding methods and devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,785, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Trim free wafer bonding methods and devices" was invented by Shi Ning Ju (Hsinchu, Taiwan), Wen-Ting Lan (Hsinchu, Taiwan), I-Han Huang (Hsinchu, Taiwan), Kuo-Cheng Chiang (Hsinchu, Taiwan) and Chih-Hao Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device structure includes bonding a device substrate to a first de-bond layer. The first de-bond layer is disposed on a first carrier substrate, and the device substrate has a first side facing the first carrier substrate and a second side...