US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "Techniques for heat dispersion in 3D integrated circuit" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,717, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Techniques for heat dispersion in 3D integrated circuit" was invented by Chien Ta Huang (Taoyuan, Taiwan), Chun-Yang Tsai (Hsinchu, Taiwan), Yi Ching Ong (Hsinchu, Taiwan), Kuo-Ching Huang (Hsinchu, Taiwan) and Harry-Hak-Lay Chuang (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments relate to a method of forming a redistribution layer (RDL) stack of a 3D integrated circuit stack. The method comprises removing a substrate form the first side of a first die to expose a first dielectric layer. A spiral trench is formed in ...