US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "Stacked integrated circuits with redistribution lines" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,791, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Stacked integrated circuits with redistribution lines" was invented by Cheng-Ying Ho (Minxiong Township, Taiwan), Jeng-Shyan Lin (Tainan, Taiwan), Wen-I Hsu (Tainan, Taiwan), Feng-Chi Hung (Chubei, Taiwan), Dun-Nian Yaung (Taipei, Taiwan) and Ying-Ling Tsai (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding a first wafer to a second wafer, with a first plurality of dielectric layers in the first wafer and a second plurality of dielectric layers in the second wafer bonded between a first substrate of the first...