US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "Semiconductor packages and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,757, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor packages and methods of manufacturing thereof" was invented by Ming-Fa Chen (Hsinchu, Taiwan), Yun-Han Lee (Hsinchu, Taiwan) and Lee-Chung Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a first chip including a plurality of first device features and a plurality of first interconnect structures disposed above the first device features; a second chip including a plurality of second device features and a plurality of second interconnect structures disposed above the second device feat...