US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "Semiconductor package including a surface with a plurality of roughness values and methods of forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,735, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package including a surface with a plurality of roughness values and methods of forming the same" was invented by Wei-Hung Lin (Xinfeng Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate including an upper surface layer including a first surface area having a first surface roughness, and a second surface area having a second surface roughness less than the first surface roughness, and an interposer module mounted on the upper surface layer of the package substrate in t...