US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "Semiconductor device package and methods of formation" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,763, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device package and methods of formation" was invented by Tien-Chung Yang (Hsinchu, Taiwan), Li-Hsien Huang (Zhubei, Taiwan), Ming-Feng Wu (Miaoli County, Taiwan), Yung-Sheng Liu (Hsinchu, Taiwan), Chun-Jen Chen (Jhubei, Taiwan) and Jun He (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laser grooving operation is performed to form a plurality of grooves in a semiconductor die prior to attaching the semiconductor die to a semiconductor device package substrate. In addition to forming a first groove through which blade...