US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "Semiconductor device having redistribution layers formed on an active wafer and methods of making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,753, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device having redistribution layers formed on an active wafer and methods of making the same" was invented by Kuo-Chiang Ting (Hsinchu, Taiwan), Tu-Hao Yu (Hsinchu, Taiwan), Shun-Jang Laio (Pingjhen, Taiwan), Chien-Chung Wang (New Taipei, Taiwan) and Chia-Ching Lin (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment semiconductor device may include a semiconductor die; one or more redistribution layers formed on a surface of the semiconductor die and electrically coupled to the semiconductor die; and an act...