US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "Packages with stacked dies and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,790, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Packages with stacked dies and methods of forming the same" was invented by Chien-Hsun Lee (Chu-tung Town, Taiwan), Tsung-Ding Wang (Tainan, Taiwan), Mirng-Ji Lii (Sinpu Township, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding a first plurality of device dies onto a wafer, wherein the wafer includes a second plurality of device dies, with each of the first plurality of device dies bonded to one of the second plurality of device dies. The wafer is then sawed to form a die stack, wh...