US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "MIMcap corner structures in the keep-out zones of a semiconductor die and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,766, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"MIMcap corner structures in the keep-out zones of a semiconductor die and methods of forming the same" was invented by Yen-Kun Lai (New Taipei, Taiwan), Chien Hao Hsu (Zhubei, Taiwan), Wei-Hsiang Tu (Hsinchu, Taiwan), Kuo-Chin Chang (Chiayi, Taiwan) and Mirng-Ji Lii (Sinpu Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die includes semiconductor devices located on a semiconductor substrate, metal-insulator-metal corner structures overlying the semiconductor devices and located in corner regions of the semiconductor...