US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 25 for "Integrated circuit structure with backside via rail" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,254, issued on Nov. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit structure with backside via rail" was invented by Huan-Chieh Su (Changhua County, Taiwan), Li-Zhen Yu (New Taipei, Taiwan), Chun-Yuan Chen (Hsinchu, Taiwan), Cheng-Chi Chuang (New Taipei, Taiwan), Shang-Wen Chang (Hsinchu County, Taiwan), Yi-Hsun Chiu (Hsinchu County, Taiwan), Pei-Yu Wang (Hsinchu, Taiwan), Ching-Wei Tsai (Hsinchu, Taiwan) and Chih-Hao Wang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An IC structure includes a first transistor, first gate spacers, a second transistor, second gate s...