US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "Chip package structure including an underfill material portion comprising a cut region" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,780, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Chip package structure including an underfill material portion comprising a cut region" was invented by Chia-Kuei Hsu (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Li-Ling Liao (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Devices and method for forming a chip package structure including at least one semiconductor die attached to a redistribution structure, a molding compound die frame laterally surrounding the at least one semiconductor die,...