US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "Bonding structure of dies with dangling bonds" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,772, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bonding structure of dies with dangling bonds" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Ming-Fa Chen (Taichung, Taiwan) and Chih-Chia Hu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes polishing a semiconductor substrate of a first die to reveal first through-vias that extend into the semiconductor substrate, forming a dielectric layer on the semiconductor substrate, and forming a plurality of bond pads in the dielectric layer. The plurality of bond pads include active bond pads and dummy bond pads. The ac...