US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "Apparatus and methods for automatically handling die carriers" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,685, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Apparatus and methods for automatically handling die carriers" was invented by Tsung-Sheng Kuo (Hsin-Chu, Taiwan), Cheng-Lung Wu (Hsin-Chu, Taiwan), Chih-Hung Huang (Hsin-Chu, Taiwan), Yang-Ann Chu (Hsin-Chu, Taiwan), Hsuan Lee (Tainan, Taiwan) and Jiun-Rong Pai (Jhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies;...