US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 18 for "Systems for removing or inserting a fastener from or into a wafer carrier" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,595, issued on Nov. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Systems for removing or inserting a fastener from or into a wafer carrier" was invented by Yu-Chen Chen (Hemei Township, Taiwan), Chih-Hung Huang (Hsinchu, Taiwan), Cheng-Lung Wu (Zhunan Township, Taiwan), Yang-Ann Chu (Hsinchu, Taiwan) and Jiun-Rong Pai (Jhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to systems and methods for affixing and/or removing a fastener from a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The s...