US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 18 for "Stiffener structure with beveled sidewall for footprint reduction and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,203, issued on Nov. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Stiffener structure with beveled sidewall for footprint reduction and methods for forming the same" was invented by Chia-Kuei Hsu (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Li-Ling Liao (Hsinchu, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Devices and method for forming a chip package structure including a package substrate, a fan-out package attached to the package substrate, a first adhesive layer attached to a top surface of the package substrate, a beveled stiffener structure attac...