US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 18 for "Semiconductor packages and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,157, issued on Nov. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor packages and method of manufacturing the same" was invented by Shih-Hao Tseng (Hsinchu, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan) and Ming-Che Ho (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first integrated circuit, a first passivation layer, a second passivation layer, a thermal pattern, an adhesive layer and a second integrated circuit. The first integrated circuit is encapsulated by an encapsulant. The first passivation layer is disposed over the first integrated circuit and the ...