US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 18 for "Semiconductor package including step seal ring and methods forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,140, issued on Nov. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package including step seal ring and methods forming same" was invented by Sheng-Han Tsai (Hsinchu, Taiwan), Yuan Sheng Chiu (Miaoli, Taiwan), Chou-Jui Hsu (Taoyuan, Taiwan) and Tsung-Shu Lin (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a plurality of dielectric layers over a semiconductor substrate, forming a plurality of metal lines and vias in the plurality of dielectric layers, forming a lower portion of an inner seal ring and a lower portion of an outer seal ring extending into the...