US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 18 for "Semiconductor package assembly and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,647, issued on Nov. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package assembly and method of manufacturing the same" was invented by Jian-Ting Chen (Hsinchu County, Taiwan), Cheng-Wei Lu (Hsinchu, Taiwan) and Kuang-Hua Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semicondu...