US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 18 for "Semiconductor package and method of manufacturing" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,213, issued on Nov. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method of manufacturing" was invented by Chien Li (Taoyuan, Taiwan), Chih-Ju Yen (New Taipei, Taiwan), Jui Hsien Lo (New Taipei, Taiwan), Chien-Sheng Chen (Hsinchu, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some implementations described herein provide a semiconductor package including an integrated circuit die mounted to an interposer using connection structures. An underfill material between the integrated circuit die and the interposer includes shaped fillets that are bel...