US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 18 for "Semiconductor package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,135, issued on Nov. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Semiconductor package and method" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Wei-Yu Chen (Hsinchu, Taiwan), Jiun Yi Wu (Zhongli, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan) and Chien-Hsun Lee (Chu-tung Town, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes attaching interconnect structures to a carrier substrate, wherein each interconnect structure includes a redistribution structure; a first encapsulant on the redistribution structure; and a via extending through the encapsulant to physically and electrically connect to th...