US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 18 for "Semiconductor image-sensing structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,841, issued on Nov. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor image-sensing structure and method for forming the same" was invented by Sung-Hsin Yang (Tainan, Taiwan), Jung-Chi Jeng (Tainan, Taiwan) and Ru-Shang Hsiao (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor image-sensing structure includes a semiconductor substrate having a sensor region and a circuitry region, a plurality of fin structures disposed in the circuitry region, a mesa structure disposed in the sensor region, a first gate structure disposed over the plurality of fin structures in th...