US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 18 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,794, issued on Nov. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Yan-Ting Lin (Hsinchu County, Taiwan), Chien-I Kuo (Chiayi County, Taiwan), Chii-Horng Li (Hsinchu County, Taiwan) and Yee-Chia Yeo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a plurality of channel layers above a (110)-orientated substrate, the channel layers arranged in a greater than110less than direction normal to a top surface the (110)-orientated substrate and extending in a greater than110less than direction perpendicular...