ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,211, issued on Nov. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device" was invented by Chien-Hao Hsu (Hsinchu County, Taiwan), Yen-Kun Lai (New Taipei, Taiwan), Wei-Hsiang Tu (Hsinchu, Taiwan), Hao-Chun Liu (Hsinchu, Taiwan), Kuo-Chin Chang (Chiayi, Taiwan) and Mirng-Ji Lii (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including a semiconductor die, a first conductive pad, a second conductive pad, a first connector structure and a second connector structure is provided. The first conductive pad is disposed on the semiconductor die, wherein the firs...