ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,206, issued on Nov. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Seal ring for hybrid-bond" was invented by Chih-Chia Hu (Taipei, Taiwan), Chun-Chiang Kuo (Kaohsiung, Taiwan), Sen-Bor Jan (Tainan, Taiwan), Ming-Fa Chen (Taichung, Taiwan) and Hsien-Wei Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A structure includes a first die and a second die. The first die includes a first bonding layer having a first plurality of bond pads disposed therein and a first seal ring disposed in the first bonding layer. The first bonding layer extends over the first seal ring. The second die includes a sec...