US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 18 for "Package structure with adhesive element over semiconductor chip" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,198, issued on Nov. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure with adhesive element over semiconductor chip" was invented by Po-Hao Tsai (Zhongli, Taiwan), Techi Wong (Zhubei, Taiwan), Yi-Wen Wu (New Taipei, Taiwan), Po-Yao Chuang (Hsin-Chu, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a redistribution structure and a semiconductor chip over the redistribution structure. The package structure also includes an adhesive element over the semiconductor chip. Opposite outermost edges ...