US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 18 for "Method of manufacturing semiconductor devices with system on chip devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,847, issued on Nov. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of manufacturing semiconductor devices with system on chip devices" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan), Wen-Chih Chiou (Zhunan Township, Taiwan), Ming-Fa Chen (Taichung, Taiwan) and Sung-Feng Yeh (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and method of manufacture are provided wherein the semiconductor device includes a first system on chip device bonded to a first memory device, a second system on chip device bonded to the first memory device, a first e...