US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 18 for "Inverted trapezoidal heat dissipating solder structure and method of making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,166, issued on Nov. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Inverted trapezoidal heat dissipating solder structure and method of making the same" was invented by Chang-Jung Hsueh (Taipei, Taiwan), Yen Wei Chang (Taipei, Taiwan), Cheng-Nan Lin (Hsinchu, Taiwan), Wei-Hung Lin (Xinfeng Township, Taiwan) and Ming-Da Cheng (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of forming a heat dissipating structure for a semiconductor chip, a soldering material is disposed on a top surface of the semiconductor chip. A first region of metal plating is formed on a surface of a lid. The f...