US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 18 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,139, issued on Nov. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Ting-Chen Tseng (Hsinchu, Taiwan), Sih-Hao Liao (New Taipei, Taiwan), Po-Han Wang (Hsinchu, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan) and Hung-Jui Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a method includes: dispensing a first dielectric layer around and on a first metallization pattern, the first dielectric layer including a photoinsensitive molding compound; planarizing the first dielectric layer such that surfaces of the first dielectric layer and t...