US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 18 for "3DIC interconnect apparatus and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,224, issued on Nov. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"3DIC interconnect apparatus and method" was invented by Shu-Ting Tsai (Kaohsiung, Taiwan), Dun-Nian Yaung (Taipei, Taiwan), Jen-Cheng Liu (Hsinchu, Taiwan), Chun-Chieh Chuang (Tainan, Taiwan), Chia-Chieh Lin (Kaohsiung, Taiwan) and U-Ting Chen (Wanluan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect apparatus and a method of forming the interconnect apparatus is provided. Two integrated circuits are bonded together. A first opening is formed through one of the substrates. A multi-layer dielectric film is formed alon...