US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 11 for "Support structure to reinforce stacked semiconductor wafers" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,817, issued on Nov. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Support structure to reinforce stacked semiconductor wafers" was invented by Kuo-Ming Wu (Zhubei, Taiwan), Hau-Yi Hsiao (Chiayi, Taiwan), Ping-Tzu Chen (Tainan, Taiwan), Chung-Jen Huang (Tainan, Taiwan) and Sheng-Chau Chen (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure. The method includes bonding a first semiconductor wafer to a second semiconductor wafer. A bond interface is disposed between the first and second semic...