US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 11 for "Semiconductor structures and methods for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,760, issued on Nov. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structures and methods for manufacturing the same" was invented by Jui-Wen Su (Hsinchu, Taiwan), Shi-Hua Tzeng (Hsinchu, Taiwan), Chih-Hung Lu (Hsinchu, Taiwan) and Po-Chi Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In order to reduce the incidence of stress concentration areas in an etched opening, a thinner polyimide layer is deposited to minimize gap formation therein, and a descum process is then performed to increase the angle of the presented layer surface. Reduction of the stress in this manner reduc...