US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 11 for "Semiconductor package structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,768, issued on Nov. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor package structure and method for forming the same" was invented by Kuo Wen Chen (Hsinchu, Taiwan), Hsiang-Tai Lu (Hsinchu County, Taiwan), Chih-Hsuan Tai (Taipei, Taiwan) and Ming-Chung Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, a capacitor disposed in the substrate, an interconnect structure disposed over the substrate, and a first doped region disposed in the substrate. The interconnect structure includes a first via structure coupled to the substrate, and ...