US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 11 for "Semiconductor package and semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,834, issued on Nov. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and semiconductor device" was invented by Shu-Jung Tseng (Taichung County, Taiwan) and Hui-Chang Yu (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are semiconductor packages and semiconductor devices. In one embodiment, a semiconductor package includes a package, a first integrated passive device, and a second integrated passive device. The first integrated passive device is disposed below the package. The second integrated passive device is disposed between the package and the first integrat...