ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,800, issued on Nov. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).
"Semiconductor device" was invented by Zi-Jheng Liu (Taoyuan, Taiwan), Jo-Lin Lan (Kaohsiung, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan) and Hung-Jui Kuo (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a molding compound, a plurality of through vias, a seal ring structure, and a protection layer. The plurality of through vias are embedded in the molding compound. The seal ring structure is over the molding compound and surrounds the through vias in a top view. The protection layer covers the seal ring and extends towa...