US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 11 for "Packages with multiple types of underfill and method forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,821, issued on Nov. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Packages with multiple types of underfill and method forming the same" was invented by Kuan-Yu Huang (Taipei, Taiwan), Li-Chung Kuo (Taipei, Taiwan), Sung-Hui Huang (Dongshan Township, Taiwan) and Shang-Yun Hou (Jubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding a first package component over a second package component, dispensing a first underfill between the first package component and the second package component, and bonding a third package component over the second package component. A second underfill is b...