US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 11 for "Package with improved heat dissipation efficiency and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,763, issued on Nov. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package with improved heat dissipation efficiency and method for forming the same" was invented by Tung-Liang Shao (Hsinchu, Taiwan), Yu-Sheng Huang (Hemei Township, Taiwan), Kuo Yang Wu (Taoyuan, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a package is provided. The package includes a semiconductor device; an encapsulant laterally surrounding the semiconductor device; and a heat dissipation structure disposed over the semiconductor device and the encapsulant, wherein the heat dissipati...