US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 11 for "Package structure including a die having a taper-shaped die connector" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,757, issued on Nov. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure including a die having a taper-shaped die connector" was invented by Hung-Jui Kuo (Hsinchu, Taiwan), Hui-Jung Tsai (Hsinchu, Taiwan), Tai-Min Chang (Taipei, Taiwan) and Chia-Wei Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a package structure including a first die and an encapsulant. The first die includes a substrate, a plurality of pads over the substrate, a passivation layer on portions of each of the plurality of pads, a plurality of first die connectors on the plurality of pads, respective...