US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 11 for "Multi-function substrate" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,379, issued on Nov. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Multi-function substrate" was invented by Eugene I-Chun Chen (Taipei, Taiwan), Kuan-Liang Liu (Pingtung, Taiwan), Szu-Yu Wang (Hsinchu, Taiwan), Chia-Shiung Tsai (Hsin-Chu, Taiwan), Ru-Liang Lee (Hsinchu, Taiwan), Chih-Ping Chao (Hsin-Chu, Taiwan) and Alexander Kalnitsky (San Francisco).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an integrated chip. The integrated chip includes an epitaxial layer arranged on a semiconductor body. A trap-rich layer is arranged on the epitaxial layer, a dielectric layer is arrange...