US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 11 for "Method of manufacturing a semiconductor device" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,710, issued on Nov. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of manufacturing a semiconductor device" was invented by Chun Hsiung Tsai (Xinpu Township, Taiwan), Yu-Ming Lin (Hsinchu, Taiwan), Kuo-Feng Yu (Zhudong Township, Taiwan), Ming-Hsi Yeh (Hsinchu, Taiwan), Shahaji B. More (Hsinchu, Taiwan), Chandrashekhar Prakash Savant (Hsinchu, Taiwan), Chih-Hsin Ko (Fongshan, Taiwan) and Clement Hsingjen Wann (Carmel, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of manufacturing a semiconductor device, a fin structure is formed by patterning a semiconductor layer, and an annealing ope...