US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 11 for "Method of forming semiconductor device having segmented interconnect" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,377, issued on Nov. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of forming semiconductor device having segmented interconnect" was invented by Chih-Yu Lai (Hsinchu, Taiwan), Chih-Liang Chen (Hsinchu, Taiwan), Ching-Wei Tsai (Hsinchu, Taiwan), Shang-Wen Chang (Hsinchu, Taiwan) and Li-Chun Tien (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making a semiconductor device includes manufacturing a first bridge pillar; manufacturing a first transistor channel bar and first transistor source/drain electrode, the first transistor S/D electrode electrically connecting to the firs...