US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 11 for "Method for manufacturing semiconductor package with connection structures including via groups" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,812, issued on Nov. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method for manufacturing semiconductor package with connection structures including via groups" was invented by Chien-Hsun Chen (Zhutian Township, Taiwan), Jiun Yi Wu (Zhongli, Taiwan), Chien-Hsun Lee (Chu-tung Town, Taiwan) and Chung-Shi Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes placing a package component over a carrier, encapsulating the package component in an encapsulant, and forming a connection structure over and electrically coupling to the package component. The formation of the connection struc...