US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 11 for "Method and apparatus for bonding semiconductor substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,818, issued on Nov. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method and apparatus for bonding semiconductor substrate" was invented by Ying-Jui Huang (Hsinchu County, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Chien-Ling Hwang (Hsinchu, Taiwan) and Chia-Sheng Huang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and an apparatus for bonding semiconductor substrates are provided. The apparatus includes a first support configured to carry a first semiconductor substrate and a second semiconductor substrate bonded to each other, a gauging component embedded in the first support...