US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 11 for "Integrated circuit package and method of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,814, issued on Nov. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method of forming same" was invented by Yu-Sheng Lin (Zhubei, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Chin-Hua Wang (New Taipei, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a package substrate, the package substrate having a first side and a second side opposite to the first side, a package component bonded to the first side of the package substrate, a front-side warpage control structure attached to the first side of t...