US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 11 for "Integrated circuit component and package structure having the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,753, issued on Nov. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit component and package structure having the same" was invented by Tzuan-Horng Liu (Taoyuan, Taiwan), Chao-Hsiang Yang (Hsinchu, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan) and Ming-Fa Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit component includes a semiconductor substrate, conductive pads, a passivation layer and conductive vias. The semiconductor substrate has an active surface. The conductive pads are located on the active surface of the semiconductor substrate and electrically conn...