US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 11 for "Fan-out package structures with cascaded openings in enhancement layer" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,807, issued on Nov. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Fan-out package structures with cascaded openings in enhancement layer" was invented by Ting-Ting Kuo (Hsinchu, Taiwan), Li-Hsien Huang (Hsinchu, Taiwan), Tien-Chung Yang (Hsinchu, Taiwan), Yao-Chun Chuang (Hsinchu, Taiwan), Yinlung Lu (Hsinchu, Taiwan) and Jun He (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure is provided. The semiconductor package structure includes: a die having a frontside and a backside; a first redistribution layer (RDL) structure disposed on the backside of the die; a second...