US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 11 for "Energy harvest and storage device for semiconductor chips and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,803, issued on Nov. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Energy harvest and storage device for semiconductor chips and methods for forming the same" was invented by Kuen-Yi Chen (Hsinchu, Taiwan), Yi Ching Ong (Hsinchu, Taiwan), Kuo-Ching Huang (Hsinchu, Taiwan) and Harry-Hak-Lay Chuang (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure may be located over a substrate, and may include a parallel connection of a first component and a second component. The first component includes a series connection of a diode and a capacitor that is selected from a metal-ferroelectr...