US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 11 for "Dense redistribution layers in semiconductor packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,718, issued on Nov. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Dense redistribution layers in semiconductor packages and methods of forming the same" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan) and Hui-Jung Tsai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method embodiment includes forming a patterned first photo resist over a seed layer. A first opening in the patterned first photo resist exposes the seed layer. The method further includes plating a first conductive material in the first opening on the seed layer, removing the patterned first photo resi...