US Patent Issued to Taiwan Semiconductor Manufacturing on May 6 for "System and method for removing impurities during chemical mechanical planarization" (Taiwanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,917, issued on May 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"System and method for removing impurities during chemical mechanical planarization" was invented by Te-Chien Hou (Hsinchu, Taiwan), Po-Chin Nien (Hsinchu, Taiwan), Chih Hung Chen (Hsinchu, Taiwan), Ying-Tsung Chen (Hsinchu, Taiwan) and Kei-Wei Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical mechanical planarization system includes a chemical mechanical planarization pad that rotates during a chemical mechanical planarization process. A chemical mechanical planarization head places a semiconductor wafer in contact with...